|
|
Purpose
The purpose of this Final Critical Design Review document for the DOM Main Board is to gather all of the relevant documents, data and links to support the conclusion that the DOM Main Board design is complete, correct, satisfies requirements and can be manufactured using industry standard, commercially available processes.
Scope
Applies to the DOM Main Board that is integrated into all DOM types at all DOM manufacturing sites.
Reference Documents:
Document # |
Title of document |
31Y080 |
DOM Main Board Document Log |
31Y081 |
Assembly Drawing, DOMMB, Rev5.1A, Ver5.1D
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1538 |
31Y082 |
Fabrication Drawing, DOMMB, Rev5.1A, Ver1.1
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1540 |
31Y083 |
Schematic Diagram, DOMMB, Rev5.1A, Ver1.0
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1541 |
31Y084 |
Artwork files, DOMMB, Rev5.1A
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1540 |
31Y085 |
DOMMB Status List, Rev 5.1
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2539 |
31Y086 |
Test Traveler, DOMMB, Rev5.1, Ver2.21
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2538 |
31Y087 |
Test Procedure, DOMMB Initial Power-On and Memory Loading
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2538 |
31Y088 |
Test Procedure, DOMMB HASS Test Procedure Ver1.1
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2538 |
31Y089 |
Test Procedure, DOMMB Hot and Cold Burn In Procedure-v1.0
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2538 |
31Y090 |
Consigned Component List, DOMMB, Rev5.1, Ver1.0
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1542 |
31Y091 |
Test Procedure, DOMMB Integration Ver1.0
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2538 |
31Y092 |
Assembly Instruction, Delay Board, Ver1.1
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1538 |
31Y093 |
Acceptance Criteria Plan, DOMMB, Rev5.1, Ver1.1
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-1568 |
31Y095 |
ATWD Bonding Diagram
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2588 |
31Y096 |
ATWD Package Marking Instruction
http://docushare.icecube.wisc.edu/docushare/dsweb/View/Collection-2588 |
|